JEC Europe 2013: LED UV Technology for bonding applications

IST METZ presents new LED systems for bonding and encapsulation by means of UV technology

At JEC Europe, which will take place from 11th - 13thMarch in Paris, France, UV system manufacturer IST METZ will be presenting a wide range of products for curing adhesives using UV technology at Stand S9.
IST METZ GmbH offers a wide range of UV systems for applications in the fields of electronics, opto-electronics and medical technology, and also for bonding glass, plastics and metal. The company’s adhesion and encapsulation portfolio includes both conventional UV systems and LED units for curing cationic, radical and dual-cure adhesives. From spot bonding to large-area adhesion, these systems can be used to implement a variety of applications.

The wave length and intensity of the UV light used in the systems is designed to suit the specialist demands of adhesives. What is more, the UV technology has several key benefits compared to conventional procedures: it hardens adhesives in a matter of seconds, allowing processing of the material to continue immediately, and also offers high levels of rigidity and resistance. This also applies to the manufacturing and bonding of composite materials. At the stand IST METZ shows examples for applications like this.

Amongst others, IST METZ presents the latest developments of its partner Integration Technology Ltd. including the SubZero LED. The air-cooled system is used for the curing of adhesives and sealants as well as for the curing of industrial coatings or in the printing area. Once switched on, the LED UV system is ready straight away. It also transmits very little heat to the substrate and has an extremely long service life.