by RadTech Europe

In this section, you can find any news issued by RadTech Europe.

RadTech, the trade association for UV & EB curing technology, is pleased to announce the adoption of ASTM D7767-11, “Standard Test Method to Measure Volatiles from Radiation Curable Acrylate Monomers, Oligomers, and Blends and Thin Coatings Made from Them.”
The total market for radiation curing ink for packaging will grow 24% from its 2011 base to almost 37,500 tonnes by 2016. In value terms 60% plus growth will take the market to over $883 million in the same period according to a new study by Pira International and RadTech Europe.
The last months RadTech Europe has been working on a brand new website. This new virtual center enables visitors to learn more about UV/EB Technology and relevant industries. RTE will also introduce a knowledge center with previous proceedings and interesting articles.
The RadTech Conference discusses the latest radiation curing technology. This year the participants from all over the world will focus on the impact of new materials and curing equipment on innovative and existing market applications.
RadTech Europe organized a highly successful two-day curing event titled “2nd RTE Metal Coatings Seminar” in collaboration with OCAS N.V., field experts of coating suppliers, manufactures and end-users on 26 – 27 January 2011.
Pira International and RadTech Europe agreed to work together on a new market study named ‘The Future of Radiation Curing for Packaging’. The study will kick-off in early 2011 with a final publication date in the summer of 2011.
The second RadTech Europe food packaging seminar of the year took place in Paris, France on the 9th of November. Once again, RadTech Europe succeeded in attracting a group of expert speakers to inform attendants of the various technical and regulatory facets of safe printing of food packaging. In order to reach local companies and end-users, the presentations were offered in French.
RadTech Europe is aware of recent issues with migration of ink ingredients in food packaging and encourages anyone with questions about these issues to contact RadTech Europe for support and guidance.
During the RTE General Assembly 2010 in Hamburg, Germany, the Management Committee welcomed their new President David Helsby.
RadTech Europe had a very successful conference in Germany and will as a follow-up organize a similar event in France on September 30th around printing & packaging materials. The seminar was triggered by input from the members, statements of the members in the press and on their websites, various food alerts, articles and programs in the media on food packaging that were linked to radiation curing printing systems.